Industrial Auxiliaries

  (1) Flame-retardant

• Ammonium polyphosphate (APP)

• Tetrakis(hydroxymethyl)phosphonium chloride (THPC)

• Tetrakis(hydroxymethyl)phosphonium chloride urea (THPC-Urea)

• Tetrakis(hydroxymethyl)phosphonium sulfate urea (THPS-Urea)

  (2) UV absorber and Photocure

• Benzophenone-2 (2,2',4',4'-tetrahydroxybenzophenone) (BP-2)

• Benzophenone-6 (2,2'-Dihydroxy-4,4'-dimethoxybenzophenone) (BP-6)

• Photocure BDK (Benzil Dimethyl Ketal)

• Photocure 1173

• Photocure ITX

 (3) Electroplating Auxiliary

• Bis(sodium sulfopropyl) Disulfide (SPS)  For Copper Electroplating

• 3-Mercaptopropane Sulfonic Acid Sodium Salt (3-MPS) For Copper Electroplating

• 1,3-Propane Sultone (1,3-PS)

• 3-(1-Pyridino)-1-propane Sulfonate (PPS)  For nickel Electroplating

  (4) Other

• Dibenzoylmethane (HS-83)  Heat stabilizer for PVC

• Dicumyl peroxide (DCP)

• n-Propyl bromide (nPB)     Cleaning agent

• Sodium Dodecylbenzene Sulfonate, Anionic surfactant, 85%

• Strearoyl benzoyl methane (HS-50)  Heat stabilizer for PVC

• 2,2,3,3-Tetrafluoro-1-propanol (TFP)

Copyright 2005 Wanjie International Co., Limited (China)   All rights reserved   Last Updated 26 April, 2007