Synonyms: dl-Phenylsuccinic acid; Phenyl butanedioic acid; (+/-)-Phenylsuccinic acid; PSA; Phenyl Succinic Acid
CAS No.: 635-51-8
EINECS No.: 211-238-1
China Customs Code:
Molecular Weight: 194.18
Molecular Formula: C10H10O4
Melting Point: 166-168 °C (lit.)
Boiling Point: 308 °C at 760 mmHg
Flashing point: 154 °C
Water solubility: soluble in methanol, ethanol, IPA, ether, ketone; Insoluble in benzene, CCl4.
Phenylsuccinc acid is mainly used as an acid activator for solder flux in electronic industry. Other applications includes chemical reagent and pharmaceutical synthesis. Coordinated with adipic acid and some surfactant and adjuvent, phenylsuccinic acid can increase solder paste's solderability. Function of organic acids in solder flux is to remove metal oxides during Surface Mount Technology (SMT) process.
|Phenyl Succinic acid||99.0% min.|
|m.p. (°C)||166 to 168|
|residue on ignition||0.1% max.|
|appearance||white crystal powder|
25kgs/fiber drum, on pallets.
Risks and Safety Information
Phenylsuccinic Acid is not regulated by UN. Safe for air, land and sea transportation
Risk Phrase: R36/37/38
Safety Phrase: S22, S34/25, S26, S37/39